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txb0108 sces643f ? november 2006 ? revised november 2014 txb0108 8-bit bidirectional voltage-level translator with auto-direction sensing and 15-kv esd protection 1 features 3 description this 8-bit noninverting translator uses two separate 1 ? 1.2 v to 3.6 v on a port and 1.65 v to 5.5 v on configurable power-supply rails. the a port is b port (v cca v ccb ) designed to track v cca . v cca accepts any supply ? v cc isolation feature ? if either v cc input is at voltage from 1.2 v to 3.6 v. the b port is designed to gnd, all outputs are in the high-impedance track v ccb . v ccb accepts any supply voltage from state 1.65 v to 5.5 v. this allows for universal low-voltage bidirectional translation between any of the 1.2-v, ? oe input circuit referenced to v cca 1.5-v, 1.8-v, 2.5-v, 3.3-v, and 5-v voltage nodes. ? low power consumption, 4- a max i cc v cca should not exceed v ccb . ? i off supports partial-power-down mode operation when the output-enable (oe) input is low, all outputs ? latch-up performance exceeds 100 ma per are placed in the high-impedance state. jesd 78, class ii the txb0108 is designed so that the oe input circuit ? esd protection exceeds jesd 22 is supplied by v cca . ? a port this device is fully specified for partial-power-down ? 2000-v human-body model (a114-b) applications using i off . the i off circuitry disables the ? 1000-v charged-device model (c101) outputs, preventing damaging current backflow through the device when it is powered down. ? b port ? 15-kv human-body model (a114-b) to ensure the high-impedance state during power-up or power-down, oe should be tied to gnd through a ? 8-kv human-body model (a114-b) pulldown resistor; the minimum value of the resistor is (yzp package only) determined by the current-sourcing capability of the ? 1000-v charged-device model (c101) driver. 2 applications device information (1) ? handset part number package body size (nom) tvsop (20) 5.00 mm x 4.40 mm ? smartphone son (20) 2.00 mm x 4.00 mm ? tablet bga microstar ? desktop pc 2.50 mm x 3.00 mm junior (20) txb0108 tssop (20) 6.50 mm x 4.40 mm vqfn (20) 4.50 mm x 3.50 mm dsgba (20) 1.90 mm x 2.40 mm (1) for all available packages, see the orderable addendum at the end of the datasheet. typical application block diagram for txb010x 1 an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. production data. sample &buy productfolder support &community tools & software technical documents
txb0108 sces643f ? november 2006 ? revised november 2014 www.ti.com table of contents 6.16 operating characteristics ........................................ 9 1 features .................................................................. 1 6.17 typical characteristics .......................................... 10 2 applications ........................................................... 1 7 parameter measurement information ................ 11 3 description ............................................................. 1 8 detailed description ............................................ 12 4 revision history ..................................................... 2 8.1 overview ................................................................. 12 5 pin configuration and functions ......................... 3 8.2 functional block diagram ....................................... 12 6 specifications ......................................................... 5 8.3 feature description ................................................. 13 6.1 absolute maximum ratings ..................................... 5 8.4 device functional modes ........................................ 14 6.2 handling ratings ....................................................... 5 9 application and implementation ........................ 15 6.3 recommended operating conditions ...................... 5 9.1 application information ............................................ 15 6.4 thermal information .................................................. 6 9.2 typical application ................................................. 15 6.5 electrical characteristics .......................................... 6 10 power supply recommendations ..................... 17 6.6 timing requirements: v cca = 1.2 v ......................... 7 11 layout ................................................................... 17 6.7 timing requirements: v cca = 1.5 v 0.1 v ............ 7 11.1 layout guidelines ................................................. 17 6.8 timing requirements: v cca = 1.8 v 0.15 v .......... 7 11.2 layout example .................................................... 17 6.9 timing requirements: v cca = 2.5 v 0.2 v ............ 7 6.10 timing requirements: v cca = 3.3 v 0.3 v .......... 7 12 device and documentation support ................. 18 6.11 switching characteristics: v cca = 1.2 v ................. 7 12.1 trademarks ........................................................... 18 6.12 switching characteristics: v cca = 1.5 v 0.1 v .... 8 12.2 electrostatic discharge caution ............................ 18 6.13 switching characteristics: v cca = 1.8 v 0.15 v .. 8 12.3 glossary ................................................................ 18 6.14 switching characteristics: v cca = 2.5 v 0.2 v .... 8 13 mechanical, packaging, and orderable information ........................................................... 18 6.15 switching characteristics: v cca = 3.3 v 0.3 v .... 9 4 revision history note: page numbers for previous revisions may differ from page numbers in the current version. changes from revision e (april 2012) to revision f page ? added pin configuration and functions section, handling rating table, feature description section, device functional modes , application and implementation section, power supply recommendations section, layout section, device and documentation support section, and mechanical, packaging, and orderable information section ................................................................................................................................................................................... 1 ? changed v ola value 0.9 to 0.3 .............................................................................................................................................. 6 changes from revision d (september 2011) to revision e page ? added notes to pin out graphics. ............................................................................................................................................ 3 changes from revision c (august 2011) to revision d page ? added 8-kv human-body model (a114-b) (yzp package only) to features ..................................................................... 1 2 submit documentation feedback copyright ? 2006 ? 2014, texas instruments incorporated product folder links: txb0108
txb0108 www.ti.com sces643f ? november 2006 ? revised november 2014 5 pin configuration and functions note: for the rgy package, the exposed center thermal pad must be connected to ground. a. pullup resistors are not required on both sides for logic i/o. b. if pullup or pulldown resistors are needed, the resistor value must be over 50 k . c. 50 k is a safe recommended value, if the customer can accept higher v ol or lower v oh , smaller pullup or pulldown resistor is allowed, the draft estimation is v ol = v ccout 4.5 k/(4.5 k + r pu ) and v oh = v ccout r dw /(4.5 k + r dw ). d. if pullup resistors are needed, please refer to the txs0108 or contact ti. e. for detailed information, please refer to application note scea043 . pin functions pin i/o (1) function name pw, rgy no. dqs no. yzp no. a1 1 1 a3 i/o input/output 1. referenced to v cca . v cca 2 5 c4 s a-port supply voltage. 1.1 v v cca 3.6 v, v cca v ccb . a2 3 2 a4 i/o input/output 2. referenced to v cca . a3 4 3 b3 i/o input/output 3. referenced to v cca . a4 5 4 b4 i/o input/output 4. referenced to v cca . a5 6 7 c3 i/o input/output 5. referenced to v cca . a6 7 8 e4 i/o input/output 6. referenced to v cca . a7 8 9 d3 i/o input/output 7. referenced to v cca . a8 9 10 e3 i/o input/output 8. referenced to v cca . oe 10 6 d4 i output enable. pull oe low to place all outputs in 3-state mode. referenced to v cca . gnd 11 15 d1 s ground b8 12 11 e2 i/o input/output 8. referenced to v ccb . b7 13 12 d2 i/o input/output 7. referenced to v ccb . b6 14 13 e1 i/o input/output 6. referenced to v ccb . b5 15 14 c2 i/o input/output 5. referenced to v ccb . (1) i = input, o = output, i/o = input and output, s = power supply copyright ? 2006 ? 2014, texas instruments incorporated submit documentation feedback 3 product folder links: txb0108 2019 1615 1413 12 56 78 pw package (top view) 1817 12 11 34 9 10 rgy package (top view) yzp package (ball side view) 1 20 10 11 23 4 5 6 7 8 9 1918 17 16 15 14 13 12 v ccb b2b3 b4 b5 b6 b7 b8 v cca a2a3 a4 a5 a6 a7 a8 gnd b1 a1 oe v ccb b2b3 b4 b5 b6 b7 b8 gnd v cca a1a2 a3 a4 a5 a6 a7 a8 oe b1 b1b2 b3 b4 a2 a3 a4 1 2 3 4 20 19 18 17 v ccb gndb5 b6 oe a5 a6 5 6 7 8 16 15 14 13 b7b8 a7 a8 9 10 12 11 a1 v cca dqs package (top view) b6 b8 a8 a6 gnd b7 a7 oe v ccb b5 a5 v cca b4 b3 a3 a4 b2 b1 a1 a2 1 2 3 4 ed c b a gxy or zxy p ackage (bott om view) a b c d 2 1 3 4 5
txb0108 sces643f ? november 2006 ? revised november 2014 www.ti.com pin functions (continued) pin i/o (1) function name pw, rgy no. dqs no. yzp no. b4 16 17 b1 i/o input/output 4. referenced to v ccb . b3 17 18 b2 i/o input/output 3. referenced to v ccb . b2 18 19 a1 i/o input/output 2. referenced to v ccb . v ccb 19 16 c1 s b-port supply voltage. 1.65 v v ccb 5.5 v. b1 20 20 a2 i/o input/output 1. referenced to v ccb . thermal ? ? for the rgy package, the exposed center thermal pad must be connected to ground. pad pin assignments (20-ball gxy/zxy package) 1 2 3 4 5 d v ccb b2 b4 b6 b8 c b1 b3 b5 b7 gnd b a1 a3 a5 a7 oe a v cca a2 a4 a6 a8 4 submit documentation feedback copyright ? 2006 ? 2014, texas instruments incorporated product folder links: txb0108
txb0108 www.ti.com sces643f ? november 2006 ? revised november 2014 6 specifications 6.1 absolute maximum ratings (1) over operating free-air temperature range (unless otherwise noted) min max unit v cca supply voltage range ? 0.5 4.6 v v ccb supply voltage range ? 0.5 6.5 v v i input voltage range (2) ? 0.5 6.5 v v o voltage range applied to any output in the high-impedance or power-off state (2) ? 0.5 6.5 v a inputs ? 0.5 v cca + 0.5 v o voltage range applied to any output in the high or low state (2) (3) v b inputs ? 0.5 v ccb + 0.5 i ik input clamp current v i < 0 ? 50 ma i ok output clamp current v o < 0 ? 50 ma i o continuous output current 50 ma continuous current through v cca , v ccb , or gnd 100 ma (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) the input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. (3) the value of v cca and v ccb are provided in the recommended operating conditions table. 6.2 handling ratings min max unit t stg storage temperature range ? 65 150 c human body model (hbm), per ansi/esda/jedec js-001, all 2 pins (1) , a port human body model (hbm), per ansi/esda/jedec js-001, all ? 15 15 pins (1) , b port charged device model (cdm), per jedec specification 1 v (esd) electrostatic discharge kv jesd22-c101, all pins (2) , a port charged device model (cdm), per jedec specification ? 8 8 jesd22-c101, all pins (2) , a port (yzp package only) charged device model (cdm), per jedec specification 1 jesd22-c101, all pins (2) , b port (1) jedec document jep155 states that 500-v hbm allows safe manufacturing with a standard esd control process. (2) jedec document jep157 states that 250-v cdm allows safe manufacturing with a standard esd control process. 6.3 recommended operating conditions over operating free-air temperature range (unless otherwise noted) (1) (2) v cca v ccb min max unit v cca 1.2 3.6 supply voltage v v ccb 1.65 5.5 data inputs v cci x 0.65 (3) v cci v ih high-level input voltage 1.2 v to 3.6 v 1.65 v to 5.5 v v oe v cca x 0.65 5.5 data inputs 1.2 v to 5.5 v 0 v cci x 0.35 (3) v il low-level input voltage 1.65 v to 5.5 v v oe 1.2 v to 3.6 v 0 v cca x 0.35 a-port inputs 1.2 v to 3.6 v 1.65 v to 5.5 v 40 input transition t/ v 1.65 v to 3.6 v 40 ns/v rise or fall rate b-port inputs 1.2 v to 3.6 v 4.5 v to 5.5 v 30 t a operating free-air temperature ? 40 85 c (1) the a and b sides of an unused data i/o pair must be held in the same state, i.e., both at v cci or both at gnd. (2) v cca must be less than or equal to v ccb and must not exceed 3.6 v. (3) v cci is the supply voltage associated with the input port. copyright ? 2006 ? 2014, texas instruments incorporated submit documentation feedback 5 product folder links: txb0108
txb0108 sces643f ? november 2006 ? revised november 2014 www.ti.com 6.4 thermal information txb0108 thermal metric (1) pw rgy dqs yzp gxy zxy unit 20 pins r ja junction-to-ambient thermal resistance 101.8 35.3 108.5 66.2 156.7 156.7 r jc(to junction-to-case (top) thermal resistance 35.5 42.1 32.3 0.4 39.9 39.9 p) r jb junction-to-board thermal resistance 52.8 11.1 42.4 52.0 85.9 85.9 c/w jt junction-to-top characterization parameter 2.2 0.7 0.7 1.5 1.1 1.1 jb junction-to-board characterization parameter 52.2 11.2 42 51.9 85.4 85.4 r jc(b junction-to-case (bottom) thermal resistance ? 3.8 ? ? ? ? ot) (1) for more information about traditional and new thermal metrics, see the ic package thermal metrics application report, spra953 . 6.5 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) (1) (2) t a = 25 c ? 40 c to 85 c test parameter v cca v ccb unit conditions min typ max min max 1.2 v 1.1 v oha i oh = ? 20 a v 1.4 v to 3.6 v v cca ? 0.4 1.2 v 0.3 v ola i ol = 20 a v 1.4 v to 3.6 v 0.4 v ohb i oh = ? 20 a 1.65 v to 5.5 v v ccb ? 0.4 v v olb i ol = 20 a 1.65 v to 5.5 v 0.4 v i i oe 1.2 v to 3.6 v 1.65 v to 5.5 v 1 2 a a port 0 v 0 v to 5.5 v 1 2 i off a b port 0 v to 3.6 v 0 v 1 2 i oz a or b port oe = gnd 1.2 v to 3.6 v 1.65 v to 5.5 v 1 2 a 1.2 v 0.06 1.65 v to 5.5 v 1.4 v to 3.6 v 5 v i = v cci or gnd, i cca a i o = 0 3.6 v 0 v 2 0 v 5.5 v ? 2 1.2 v 3.4 1.65 v to 5.5 v 1.4 v to 3.6 v 5 v i = v cci or gnd, i ccb a i o = 0 3.6 v 0 v ? 2 0 v 5.5 v 2 1.2 v 3.5 v i = v cci or gnd, i cca + i ccb 1.65 v to 5.5 v a i o = 0 1.4 v to 3.6 v 10 v i = v cci or gnd, 1.2 v 0.05 i ccza i o = 0, 1.65 v to 5.5 v a 1.4 v to 3.6 v 5 oe = gnd v i = v cci or gnd, 1.2 v 3.3 i cczb i o = 0, 1.65 v to 5.5 v a 1.4 v to 3.6 v 5 oe = gnd c i oe 1.2 v to 3.6 v 1.65 v to 5.5 v 5 5.5 pf a port 5 6.5 c io 1.2 v to 3.6 v 1.65 v to 5.5 v pf b port 8 10 (1) v cci is the supply voltage associated with the input port. (2) v cco is the supply voltage associated with the output port. 6 submit documentation feedback copyright ? 2006 ? 2014, texas instruments incorporated product folder links: txb0108
txb0108 www.ti.com sces643f ? november 2006 ? revised november 2014 6.6 timing requirements: v cca = 1.2 v t a = 25 c, v cca = 1.2 v v ccb = 1.8 v v ccb = 2.5 v v ccb = 3.3 v v ccb = 5 v unit typ typ typ typ data rate 20 20 20 20 mbps t w pulse duration data inputs 50 50 50 50 ns 6.7 timing requirements: v cca = 1.5 v 0.1 v over recommended operating free-air temperature range, v cca = 1.5 v 0.1 v (unless otherwise noted) v ccb = 1.8 v v ccb = 2.5 v v ccb = 3.3 v v ccb = 5 v 0.15 v 0.2 v 0.3 v 0.5 v unit min max min max min max min max data rate 50 50 50 50 mbps t w pulse duration data inputs 20 20 20 20 ns 6.8 timing requirements: v cca = 1.8 v 0.15 v over recommended operating free-air temperature range, v cca = 1.8 v 0.15 v (unless otherwise noted) v ccb = 1.8 v v ccb = 2.5 v v ccb = 3.3 v v ccb = 5 v 0.15 v 0.2 v 0.3 v 0.5 v unit min max min max min max min max data rate 52 60 60 60 mbps t w pulse duration data inputs 19 17 17 17 ns 6.9 timing requirements: v cca = 2.5 v 0.2 v over recommended operating free-air temperature range, v cca = 2.5 v 0.2 v (unless otherwise noted) v ccb = 2.5 v v ccb = 3.3 v v ccb = 5 v 0.2 v 0.3 v 0.5 v unit min max min max min max data rate 70 100 100 mbps t w pulse duration data inputs 14 10 10 ns 6.10 timing requirements: v cca = 3.3 v 0.3 v over recommended operating free-air temperature range, v cca = 3.3 v 0.3 v (unless otherwise noted) v ccb = 3.3 v v ccb = 5 v 0.3 v 0.5 v unit min max min max data rate 100 100 mbps t w pulse duration data inputs 10 10 ns 6.11 switching characteristics: v cca = 1.2 v t a = 25 c, v cca = 1.2 v v ccb = 1.8 v v ccb = 2.5 v v ccb = 3.3 v v ccb = 5 v from to parameter unit (input) (output) typ typ typ typ a b 9.5 7.9 7.6 8.5 t pd ns b a 9.2 8.8 8.4 8 a 1 1 1 1 t en oe s b 1 1 1 1 a 20 17 17 18 t dis oe ns b 20 16 15 15 t ra , t fa a-port rise and fall times 4.1 4.4 4.1 3.9 ns copyright ? 2006 ? 2014, texas instruments incorporated submit documentation feedback 7 product folder links: txb0108
txb0108 sces643f ? november 2006 ? revised november 2014 www.ti.com switching characteristics: v cca = 1.2 v (continued) t a = 25 c, v cca = 1.2 v v ccb = 1.8 v v ccb = 2.5 v v ccb = 3.3 v v ccb = 5 v from to parameter unit (input) (output) typ typ typ typ t rb , t fb b-port rise and fall times 5 5 5.1 5.1 ns t sk(o) channel-to-channel skew 2.4 1.7 1.9 7 ns max data rate 20 20 20 20 mbps 6.12 switching characteristics: v cca = 1.5 v 0.1 v over recommended operating free-air temperature range, v cca = 1.5 v 0.1 v (unless otherwise noted) v ccb = 1.8 v v ccb = 2.5 v v ccb = 3.3 v v ccb = 5 v from to 0.15 v 0.2 v 0.3 v 0.5 v parameter unit (input) (output) min max min max min max min max a b 1.4 12.9 1.2 10.1 1.1 10 0.8 9.9 t pd ns b a 0.9 14.2 0.7 12 0.4 11.7 0.3 13.7 a 1 1 1 1 t en oe s b 1 1 1 1 a 6.6 33 6.4 25.3 6.1 23.1 5.9 24.6 t dis oe ns b 6.6 35.6 5.8 25.6 5.5 22.1 5.6 20.6 t ra , t fa a-port rise and fall times 0.8 6.5 0.8 6.3 0.8 6.3 0.8 6.3 ns t rb , t fb b-port rise and fall times 1 7.3 0.7 4.9 0.7 4.6 0.6 4.6 ns t sk(o) channel-to-channel skew 2.6 1.9 1.6 1.3 ns max data rate 50 50 50 50 mbps 6.13 switching characteristics: v cca = 1.8 v 0.15 v over recommended operating free-air temperature range, v cca = 1.8 v 0.15 v (unless otherwise noted) v ccb = 1.8 v v ccb = 2.5 v v ccb = 3.3 v v ccb = 5 v from to 0.15 v 0.2 v 0.3 v 0.5 v parameter unit (input) (output) min max min max min max min max a b 1.6 11 1.4 7.7 1.3 6.8 1.2 6.5 t pd ns b a 1.5 12 1.2 8.4 0.8 7.6 0.5 7.1 a 1 1 1 1 t en oe s b 1 1 1 1 a 5.9 26.7 5.6 21.6 5.4 18.9 4.8 18.7 t dis oe ns b 6.1 33.9 5.2 23.7 5 19.9 5 17.6 t ra , t fa a-port rise and fall times 0.7 5.1 0.7 5 1 5 0.7 5 ns t rb , t fb b-port rise and fall times 1 7.3 0.7 5 0.7 3.9 0.6 3.8 ns t sk(o) channel-to-channel skew 0.8 0.7 0.6 0.6 ns max data rate 52 60 60 60 mbps 6.14 switching characteristics: v cca = 2.5 v 0.2 v over recommended operating free-air temperature range, v cca = 2.5 v 0.2 v (unless otherwise noted) v ccb = 2.5 v v ccb = 3.3 v v ccb = 5 v from to 0.2 v 0.3 v 0.5 v parameter unit (input) (output) min max min max min max a b 1.1 6.4 1 5.3 0.9 4.7 t pd ns b a 1 7 0.6 5.6 0.3 4.4 8 submit documentation feedback copyright ? 2006 ? 2014, texas instruments incorporated product folder links: txb0108
txb0108 www.ti.com sces643f ? november 2006 ? revised november 2014 switching characteristics: v cca = 2.5 v 0.2 v (continued) over recommended operating free-air temperature range, v cca = 2.5 v 0.2 v (unless otherwise noted) v ccb = 2.5 v v ccb = 3.3 v v ccb = 5 v from to 0.2 v 0.3 v 0.5 v parameter unit (input) (output) min max min max min max a 1 1 1 t en oe s b 1 1 1 a 5 16.9 4.9 15 4.5 13.8 t dis oe ns b 4.8 21.8 4.5 17.9 4.4 15.2 t ra , t fa a-port rise and fall times 0.8 3.6 0.6 3.6 0.5 3.5 ns t rb , t fb b-port rise and fall times 0.6 4.9 0.7 3.9 0.6 3.2 ns t sk(o) channel-to-channel skew 0.4 0.3 0.3 ns max data rate 70 100 100 mbps 6.15 switching characteristics: v cca = 3.3 v 0.3 v over recommended operating free-air temperature range, v cca = 3.3 v 0.3 v (unless otherwise noted) v ccb = 3.3 v v ccb = 5 v from to 0.3 v 0.5 v parameter unit (input) (output) min max min max a b 0.9 4.9 0.8 4 t pd ns b a 0.5 5.4 0.2 4 a 1 1 t en oe s b 1 1 a 4.5 13.9 4.1 12.4 t dis oe ns b 4.1 17.3 4 14.4 t ra , t fa a-port rise and fall times 0.5 3 0.5 3 ns t rb , t fb b-port rise and fall times 0.7 3.9 0.6 3.2 ns t sk(o) channel-to-channel skew 0.4 0.3 ns max data rate 100 100 mbps 6.16 operating characteristics t a = 25 c v cca 1.2 v 1.2 v 1.5 v 1.8 v 2.5 v 2.5 v 3.3 v v ccb parameter test conditions unit 3.3 v 5 v 1.8 v 1.8 v 1.8 v 2.5 v 5 v to 5 v typ typ typ typ typ typ typ a-port input, b-port output 9 8 7 7 7 7 8 c l = 0, f = 10 mhz, c pda b-port input, a-port output 12 11 11 11 11 11 11 t r = t f = 1 ns, pf oe = v cca a-port input, b-port output 35 26 27 27 27 27 28 c pdb (outputs enabled) b-port input, a-port output 26 19 18 18 18 20 21 a-port input, b-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.01 c l = 0, f = 10 mhz, c pda b-port input, a-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.01 t r = t f = 1 ns, pf oe = gnd a-port input, b-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.03 c pdb (outputs disabled) b-port input, a-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.03 copyright ? 2006 ? 2014, texas instruments incorporated submit documentation feedback 9 product folder links: txb0108
txb0108 sces643f ? november 2006 ? revised november 2014 www.ti.com 6.17 typical characteristics v ccb = 3.3 v v ccb = 3.3 v figure 1. input capacitance for oe pin (c i ) vs power supply figure 2. capacitance for a port i/o pins (c io ) vs power (v cca ) supply (v cca ) v cca = 1.8 v figure 3. capacitance fpr b port i/o pins (c io ) vs power supply (v ccb ) 10 submit documentation feedback copyright ? 2006 ? 2014, texas instruments incorporated product folder links: txb0108
txb0108 www.ti.com sces643f ? november 2006 ? revised november 2014 7 parameter measurement information figure 4. load circuits and voltage waveforms copyright ? 2006 ? 2014, texas instruments incorporated submit documentation feedback 11 product folder links: txb0108 from output under t est load circuit for enable/disable time measurement s1 2 v cco open 50 k v cci 0 v v cci /2 v cci /2 t w volt age w aveforms propaga tion dela y times volt age w aveforms pulse dura tion input t pzl /t plz t phz /t pzh 2 v cco open test s1 a. c l includes probe and jig capacitance. b. all input pulses are supplied by generators having the following characteristics: prr 10 mhz, z o = 50 , dv/dt 1 v/ns. c. the outputs are measured one at a time, with one transition per measurement. d. t plh and t phl are the same as t pd . e. v cci is the v cc associated with the input port. f. v cco is the v cc associated with the output port. g. all parameters and waveforms are not applicable to all devices. 50 k from output under t est 1 m 15 pf 15 pf load circuit for max da t a ra te, pulse dura tion prop agation dela y output rise and f all time measurement t plh t phl 0 v v cco /2 v cci /2 v cci /2 0.9 v cco v cco /2 t r 0.1 v cco t f v cci input output v oh v ol
txb0108 sces643f ? november 2006 ? revised november 2014 www.ti.com 8 detailed description 8.1 overview the txb0108 device is an 8-bit, directionless voltage-level translator specifically designed for translating logic voltage levels. the a port is able to accept i/o voltages ranging from 1.2 v to 3.6 v, while the b port can accept i/o voltages from 1.65 v to 5.5 v. the device is a buffered architecture with edge-rate accelerators (one-shots) to improve the overall data rate. this device can only translate push-pull cmos logic outputs. if for open-drain signal translation, please refer to ti txs010x products. 8.2 functional block diagram 12 submit documentation feedback copyright ? 2006 ? 2014, texas instruments incorporated product folder links: txb0108
txb0108 www.ti.com sces643f ? november 2006 ? revised november 2014 8.3 feature description 8.3.1 architecture the txb0108 architecture (see figure 5 ) does not require a direction-control signal to control the direction of data flow from a to b or from b to a. in a dc state, the output drivers of the txb0108 can maintain a high or low, but are designed to be weak so that they can be overdriven by an external driver when data on the bus starts flowing the opposite direction. the output one-shots detect rising or falling edges on the a or b ports. during a rising edge, the one-shot turns on the pmos transistors (t1, t3) for a short duration, which speeds up the low- to-high transition. similarly, during a falling edge, the one-shot turns on the nmos transistors (t2, t4) for a short duration, which speeds up the high-to-low transition. the typical output impedance during output transition is 70 at vcco = 1.2 v to 1.8 v, 50 at vcco = 1.8 v to 3.3 v and 40 at vcco = 3.3 v to 5 v. figure 5. architecture of txb0108 i/o cell 8.3.2 input driver requirements typical i in vs v in characteristics of the txb0108 are shown in figure 6 . for proper operation, the device driving the data i/os of the txb0108 must have drive strength of at least 2 ma. figure 6. typical i in vs v in curve copyright ? 2006 ? 2014, texas instruments incorporated submit documentation feedback 13 product folder links: txb0108 4k 4k a b v cca v ccb one shot one shot one shot one shot t1t2 t3t4 i in v in v t /4 k (v d v t )/4 k a. v t is the input threshold voltage of the txb0108 (typically v cci /2). b. v d is the supply voltage of the external driver .
txb0108 sces643f ? november 2006 ? revised november 2014 www.ti.com feature description (continued) 8.3.3 output load considerations ti recommends careful pcb layout practices with short pcb trace lengths to avoid excessive capacitive loading and to ensure that proper o.s. triggering takes place. pcb signal trace-lengths should be kept short enough such that the round-trip delay of any reflection is less than the one-shot duration. this improves signal integrity by ensuring that any reflection sees a low impedance at the driver. the o.s. circuits have been designed to stay on for approximately 10 ns. the maximum capacitance of the lumped load that can be driven also depends directly on the one-shot duration. with very heavy capacitive loads, the one-shot can time-out before the signal is driven fully to the positive rail. the o.s. duration has been set to best optimize trade-offs between dynamic icc, load driving capability, and maximum bit-rate considerations. both pcb trace length and connectors add to the capacitance that the txb0108 output sees, so it is recommended that this lumped-load capacitance be considered to avoid o.s. re-triggering, bus contention, output signal oscillations, or other adverse system-level affects. 8.3.4 enable and disable the txb0108 has an oe input that is used to disable the device by setting oe = low, which places all i/os in the high-impedance (hi-z) state. the disable time (tdis) indicates the delay between when oe goes low and when the outputs actually get disabled (hi-z). the enable time (ten) indicates the amount of time the user must allow for the one-shot circuitry to become operational after the oe is high. 8.3.5 pullup or pulldown resistors on i/o lines the txb0108 is designed to drive capacitive loads of up to 70 pf. the output drivers of the txb0108 have low dc drive strength. if pullup or pulldown resistors are connected externally to the data i/os, their values must be kept higher than 50 k to ensure that they do not contend with the output drivers of the txb0108. for the same reason, the txb0108 should not be used in applications such as i2c or 1-wire where an open-drain driver is connected on the bidirectional data i/o. for these applications, use a device from the ti txs01xx series of level translators. 8.4 device functional modes the txb0108 device has two functional modes, enabled and disabled. to disable the device, set the oe input low, which places all i/os in a high impedance state. setting the oe input high will enable the device. 14 submit documentation feedback copyright ? 2006 ? 2014, texas instruments incorporated product folder links: txb0108
txb0108 www.ti.com sces643f ? november 2006 ? revised november 2014 9 application and implementation note information in the following applications sections is not part of the ti component specification, and ti does not warrant its accuracy or completeness. ti ? s customers are responsible for determining suitability of components for their purposes. customers should validate and test their design implementation to confirm system functionality. 9.1 application information the txb0108 can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. it can only translate push-pull cmos logic outputs. if for open-drain signal translation, please refer to ti txs010x products. any external pulldown or pullup resistors are recommended to be larger than 50k ? . 9.2 typical application figure 7. typical operating circuit 9.2.1 design requirements for this design example, use the parameters listed in table 1 . make sure the vcca vccb. table 1. design parameters design parameter example value input voltage range 1.2 v to 3.6 v output voltage range 1.65 v to 5.5 v 9.2.2 detailed design procedure to begin the design process, determine the following: ? input voltage range - use the supply voltage of the device that is driving the txb0108 device to determine the input voltage range. for a valid logic high the value must exceed the vih of the input port. for a valid logic low, the value must be less than the vil of the input port. ? output voltage range - use the supply voltage of the device that the txb0108 device is driving to determine the output voltage range. copyright ? 2006 ? 2014, texas instruments incorporated submit documentation feedback 15 product folder links: txb0108
txb0108 sces643f ? november 2006 ? revised november 2014 www.ti.com - do not recommend having the external pullup or pulldown resistors. if mandatory, it is recommended the value should be larger than 50 k . ? an external pulldown or pullup resistor decreases the output v oh and v ol . use the below equations to draft estimate the v oh and v ol as a result of an external pulldown and pullup resistor. v oh = v ccx r pd / (r pd + 4.5 k ) v ol = v ccx 4.5k / (r pu + 4.5 k ) where: ? v ccx is the output port supply voltage on either vcca or vccb ? r pd is the value of the external pull down resistor ? r pu is the value of the external pull up resistor ? 4.5 k is the counting the variation of the serial resistor 4 k in the i/o line. 9.2.3 application curves figure 8. level-translation of a 2.5-mhz signal 16 submit documentation feedback copyright ? 2006 ? 2014, texas instruments incorporated product folder links: txb0108
txb0108 www.ti.com sces643f ? november 2006 ? revised november 2014 10 power supply recommendations during operation, ensure that v cca v ccb at all times. during power-up sequencing, v cca v ccb does not damage the device, so any power supply can be ramped up first. the txb0108 has circuitry that disables all output ports when either vcc is switched off (v cca/b = 0 v). the output-enable (oe) input circuit is designed so that it is supplied by v cca and when the (oe) input is low, all outputs are placed in the high-impedance state. to ensure the high-impedance state of the outputs during power-up or power-down, the oe input pin must be tied to gnd through a pulldown resistor and must not be enabled until v cca and v ccb are fully ramped and stable. the minimum value of the pulldown resistor to ground is determined by the current-sourcing capability of the driver. 11 layout 11.1 layout guidelines to ensure reliability of the device, the following common printed-circuit board layout guidelines is recommended. ? bypass capacitors should be used on power supplies and should be placed as close as possible to the v cca , v ccb pin and gnd pin. ? short trace lengths should be used to avoid excessive loading. ? pcb signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than the one-shot duration, approximately 10 ns, ensuring that any reflection encounters low impedance at the source driver. 11.2 layout example copyright ? 2006 ? 2014, texas instruments incorporated submit documentation feedback 17 product folder links: txb0108
txb0108 sces643f ? november 2006 ? revised november 2014 www.ti.com 12 device and documentation support 12.1 trademarks all trademarks are the property of their respective owners. 12.2 electrostatic discharge caution these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. 12.3 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions. 13 mechanical, packaging, and orderable information the following pages include mechanical, packaging, and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation. 18 submit documentation feedback copyright ? 2006 ? 2014, texas instruments incorporated product folder links: txb0108
package option addendum www.ti.com 14-nov-2018 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples TXB0108DQSR active uson dqs 20 3000 green (rohs & no sb/br) cu nipdauag level-1-260c-unlim -40 to 85 5mr 5mh txb0108pwr active tssop pw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 ye08 txb0108pwrg4 active tssop pw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 ye08 txb0108rgyr active vqfn rgy 20 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -40 to 85 ye08 txb0108yzpr active dsbga yzp 20 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 85 5m txb0108yzpr2 preview dsbga yzp 20 3000 tbd call ti call ti -40 to 85 txb0108zxyr active bga microstar junior zxy 20 2500 green (rohs & no sb/br) snagcu level-1-260c-unlim -40 to 85 ye08 (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) rohs: ti defines "rohs" to mean semiconductor products that are compliant with the current eu rohs requirements for all 10 rohs substances, including the requirement that rohs substance do not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, "rohs" products are suitable for use in specified lead-free processes. ti may reference these types of products as "pb-free". rohs exempt: ti defines "rohs exempt" to mean products that contain lead but are compliant with eu rohs pursuant to a specific eu rohs exemption. green: ti defines "green" to mean the content of chlorine (cl) and bromine (br) based flame retardants meet js709b low halogen requirements of <=1000ppm threshold. antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device.
package option addendum www.ti.com 14-nov-2018 addendum-page 2 (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant TXB0108DQSR uson dqs 20 3000 177.8 12.4 2.21 4.22 0.81 4.0 12.0 q1 txb0108rgyr vqfn rgy 20 3000 330.0 12.4 3.8 4.8 1.6 8.0 12.0 q1 txb0108yzpr dsbga yzp 20 3000 180.0 8.4 1.99 2.49 0.56 4.0 8.0 q1 txb0108zxyr bga mi crosta r juni or zxy 20 2500 330.0 12.4 2.8 3.3 1.0 4.0 12.0 q2 package materials information www.ti.com 12-jul-2018 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) TXB0108DQSR uson dqs 20 3000 202.0 201.0 28.0 txb0108rgyr vqfn rgy 20 3000 355.0 350.0 50.0 txb0108yzpr dsbga yzp 20 3000 182.0 182.0 20.0 txb0108zxyr bga microstar junior zxy 20 2500 336.6 336.6 28.6 package materials information www.ti.com 12-jul-2018 pack materials-page 2

www.ti.com package outline c 0.61 max typ 0.25 0.15 1.5 typ 2 typ 0.5 typ 0.5 typ 20x 0.35 0.25 b 3.1 2.9 a 2.6 2.4 (0.5) typ (0.5) typ vfbga - 0.61 mm max height zxy0020a plastic ball grid array 4222996/a 12/2016 notes: 1. all linear dimensions are in millimeters. any dimensions in parenthesis are for reference only. dimensioning and tolerancing per asme y14.5m. 2. this drawing is subject to change without notice. ball a1 corner seating plane ball typ 0.08 c 0.15 c b a 0.05 c symm symm (without solder) pin 1 id b 1 2 3 4 5 a c d scale 4.800
www.ti.com example board layout 20x ( 0.25) (0.5) typ (0.5) typ ( 0.25) metal 0.05 max solder mask opening metal under solder mask ( 0.25) solder mask opening 0.05 min vfbga - 0.61 mm max height zxy0020a plastic ball grid array 4222996/a 12/2016 notes: (continued) 3. final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. for information, see texas instruments literature number spraa99 (www.ti.com/lit/spraa99). symm symm land pattern example exposed metal shown scale:25x 1 2 3 4 5 a b c d non-solder mask defined (preferred) solder mask details not to scale exposed metal solder mask defined exposed metal
www.ti.com example stencil design (r0.05) typ (0.5) typ (0.5) typ 20x ( 0.25) vfbga - 0.61 mm max height zxy0020a plastic ball grid array 4222996/a 12/2016 notes: (continued) 4. laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. symm symm 1 2 3 4 5 a solder paste example based on 0.1 mm thick stencil scale: 25x b c d

d: max = e: max = 2.418 mm, min = 1.918 mm, min = 2.358 mm1.858 mm
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